一、综合词汇
1、印制电路:printedcircuit 2、印制线路:printedwiring 3、印制板:printedboard 4、印制板电路:printedcircuitboard(PCB) 5、印制线路板:printedwiringboard(PWB) 6、印制元件:printedcomponent 7、印制接点:printedcontact 8、印制板装配:printedboardassembly 9、板:board 10、单面印制板:single-sidedprintedboard(SSB) 11、双面印制板:double-sidedprintedboard(DSB) 12、多层印制板:mulitlayerprintedboard(MLB) 13、多层印制电路板:mulitlayerprintedcircuitboard 14、多层印制线路板:mulitlayerpritedwiringboard 15、刚性印制板:rigidprintedboard 16、刚性单面印制板:rigidsingle-sidedprintedborad 17、刚性双面印制板:rigiddouble-sidedprintedborad 18、刚性多层印制板:rigidmultilayerprintedboard 19、挠性多层印制板:flexiblemultilayerprintedboard 20、挠性印制板:flexibleprintedboard 21、挠性单面印制板:flexiblesingle-sidedprintedboard 22、挠性双面印制板:flexibledouble-sidedprintedboard 23、挠性印制电路:flexibleprintedcircuit(FPC) 24、挠性印制线路:flexibleprintedwiring 25、刚性印制板:flex-rigidprintedboard,rigid-flexprintedboard 26、刚性双面印制板:flex-rigiddouble-sidedprintedboard,rigid-flexdouble-sidedprinted 27、刚性多层印制板:flex-rigidmultilayerprintedboard,rigid-flexmultilayerprintedboard 28、齐平印制板:flushprintedboard 29、金属芯印制板:metalcoreprintedboard 30、金属基印制板:metalbaseprintedboard 31、多重布线印制板:mulit-wiringprintedboard 32、陶瓷印制板:ceramicsubstrateprintedboard 33、导电胶印制板:electroconductivepasteprintedboard 34、模塑电路板:moldedcircuitboard 35、模压印制板:stampedprintedwiringboard 36、顺序层压多层印制板:sequentially-laminatedmulitlayer 37、散线印制板:discretewiringboard 38、微线印制板:microwireboard 39、积层印制板:buile-upprintedboard 40、积层多层印制板:build-upmulitlayerprintedboard(BUM) 41、积层挠印制板:build-upflexibleprintedboard 42、表面层合电路板:surfacelaminarcircuit(SLC) 43、埋入凸块连印制板:B2itprintedboard 44、多层膜基板:multi-layeredfilmsubstrate(MFS) 45、层间全内导通多层印制板:ALIVHmultilayerprintedboard 46、载芯片板:chiponboard(COB) 47、埋电阻板:buriedresistanceboard 48、母板:motherboard 49、子板:daughterboard 50、背板:backplane 51、裸板:bareboard 52、键盘板夹心板:copper-invar-copperboard 53、动态挠性板:dynamicflexboard 54、静态挠性板:staticflexboard 55、可断拼板:break-awayplanel 56、电缆:cable 57、挠性扁平电缆:flexibleflatcable(FFC) 58、薄膜开关:membraneswitch 59、混合电路:hybridcircuit 60、厚膜:thickfilm 61、厚膜电路:thickfilmcircuit 62、薄膜:thinfilm 63、薄膜混合电路:thinfilmhybridcircuit 64、互连:interconnection 65、导线:conductortraceline 66、齐平导线:flushconductor 67、传输线:transmissionline 68、跨交:crossover 69、板边插头:edge-boardcontact 70、增强板:stiffener 71、基底:substrate 72、基板面:realestate 73、导线面:conductorside 74、元件面:componentside 75、焊接面:solderside 76、印制:printing 77、网格:grid 78、图形:pattern 79、导电图形:conductivepattern 80、非导电图形:non-conductivepattern 81、字符:legend 82、标志:mark
二、基材:
1、基材:basematerial 2、层压板:laminate 3、覆金属箔基材:metal-cladbadematerial 4、覆铜箔层压板:copper-cladlaminate(CCL) 5、单面覆铜箔层压板:single-sidedcopper-cladlaminate 6、双面覆铜箔层压板:double-sidedcopper-cladlaminate 7、复合层压板:compositelaminate 8、薄层压板:thinlaminate 9、金属芯覆铜箔层压板:metalcorecopper-cladlaminate 10、金属基覆铜层压板:metalbasecopper-cladlaminate 11、挠性覆铜箔绝缘薄膜:flexiblecopper-claddielectricfilm 12、基体材料:basismaterial 13、预浸材料:prepreg 14、粘结片:bondingsheet 15、预浸粘结片:preimpregnatedbondingsheer 16、环氧玻璃基板:epoxyglasssubstrate 17、加成法用层压板:laminateforadditiveprocess 18、预制内层覆箔板:masslaminationpanel 19、内层芯板:corematerial 20、催化板材:catalyzedboard,coatedcatalyzedlaminate 21、涂胶催化层压板:adhesive-coatedcatalyzedlaminate 22、涂胶无催层压板:adhesive-coateduncatalyzedlaminate 23、粘结层:bondinglayer 24、粘结膜:filmadhesive 25、涂胶粘剂绝缘薄膜:adhesivecoateddielectricfilm 26、无支撑胶粘剂膜:unsupportedadhesivefilm 27、覆盖层:coverlayer(coverlay) 28、增强板材:stiffenermaterial 29、铜箔面:copper-cladsurface 30、去铜箔面:foilremovalsurface
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